Copper stress migration at narrow metal finger with wide lead
Tài liệu tham khảo
E.T. Ogawa, J.W. McPherson, J.A. Rosal, K.J. Dickerson, T.-C. Chiu, L.Y. Tsung, M.K. Jain, T.D. Bonifield, J.C. Ondrusek, W.R. McKee, in: IEEE International Reliability Physics Symposium Proceedings, 2002, p. 312.
K.Y.Y. Doong, Robin C.J. Wang, S.C. Lin, L.J. Hung, S.Y. Lee, C.C. Chiu, David Su, Kenneth Wu, K.L.Young, Y.K. Peng, in: IEEE International Reliability Physics Symposium Proceedings, 2003, p. 156.
S.C. Lee, S.G. Lee, B.S. Shun, H. Hsin, N.I. Lee, H.K. Kang, G. Suh, in: IEEE International Interconnect Technology Conference Proceeding, 2005, p. 108.
Zhai, 2004, IEEE Trans. Dev. Mater. Rel., 4, 523, 10.1109/TDMR.2004.833225
N. Okada, Y. Matsubara, H. Kimura, H. Aizawa, N. Nakamura, in: IEEE International Interconnect Technology Conference Proceeding, 2002, p. 136.
Dauksher, 2006, Microelectron. Reliab., 46, 616, 10.1016/j.microrel.2005.05.021
Robin C.J. Wang, L.D. Chen, P.C. Yen, S.R. Lin, C.C. Chiu, K. Wu, K.S. Chang-Liao, in: IEEE International Symposium on Physical and Failure Analysis Proceedings, 2005, p. 96.