Copper stress migration at narrow metal finger with wide lead

Microelectronic Engineering - Tập 84 - Trang 2697-2701 - 2007
Robin C.J. Wang1,2, K.S. Chang-Liao1, A.S. Oates2, C.C. Lee2, L.D. Chen2, C.C. Chiu2, Kenneth Wu2
1Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan, ROC
2Taiwan Semiconductor Manufacturing Company, Hsinchu Science Park, Taiwan, ROC

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