Copper diffusion in iron during high-temperature tensile creep

Springer Science and Business Media LLC - 1971
R. R. Hough1, R. Rolls1
1Department of Metallurgy, University of Manchester Institute of Science and Technology, Manchester, UK

Tóm tắt

The diffusion of liquid copper in iron from a notched surface has been studied by metallographic, microanalysis, and sessile drop techniques. The diffusivity of copper was found to be 0.59×10−6 sq cm per sec at 1100°C and 0.97×10−6 sq cm per sec at 1130°C. The diffusion factor,D 0 was 0.78×10−3 sq cm per sec and the activation energy 19.0 kcal per mole. The predominant mode of copper penetration was along grain boundaries, but when larger volumes of copper at the iron surface were used, surface diffusion increased and grain boundary penetration remained constant. The most frequently occurring dihedral angle for liquid copper was 34 deg at 1100° and 1130°C. The liquid copper/austenite interfacial energy was found to be 444 ergs per sq cm between 1100 and 1130°C. From sessile drop measurements, the contact angle was determined as 35 deg at 1100°C and 28 deg at 1130°C, from which values the respective interfacial energies were calculated to be 387 ergs per sq cm and 301 ergs per sq cm.

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