Clean grain boundaries in aluminium nitride ceramics densified without additives by a plasma-activated sintering process

10.1038/2171287a0

Garcia M., 1993, Lawrence Livermore National Laboratory

10.1557/JMR.1992.2643

10.1007/BF02650055

Horvath S. F., 1989, Adv. Ceram., 26, 121

Johnson , D. L. 1986. Advanced Ceramics II, Edited by: Somiya , S. 1–6. London: Elsevier.

Johnson D. L., 1984, Mater. Sci. Res., 17, 207

Johnson D. L., 1980, Am. Ceram. Soc. Bull., 59, 467

Johnson , D. L. Sanderson , W. B. Knowlton , J. M. Kemer , E. L. and Chen , M. Y. 1987. High Tech Ceramics, Edited by: Vincenzini , P. 815–820. Amsterdam: Elsevier.

Kemer E. L., 1985, Am. Ceram. Soc. Bull., 64, 1132

Kijima , K. Proceedings of the Seventh International Symposium on Plasma Chemistry. Edited by: Timmerans , C. J. Vol. 2, pp.662–667. Eindhoven: Eindhoven University of Technology.

Kim J. S., 1983, Am. Ceram. Soc. Bull., 62, 620

Knittel , S. M. and Risbud , S. H. 1990. Combustion and Plasma Synthesis of High Temperature Materials, Edited by: Munir , Z. A. and Holt , J. B. 291New York: VCH.

10.1016/0304-3991(92)90126-5

McKernan , S. and Carter , C. B. Materials Research Society Symposium Proceedings, Vol. 167, Advanced Electronic Packaging Materials. pp.259Pittsburgh, Pennsylvania: Materials Research Society.

10.1111/j.1551-2916.1988.tb00174.x

10.1016/S0304-3991(79)80044-3

Sheppard L. M., 1990, Ceram. Bull., 69, 1801

Stapleton M. R., 1992, Molecular Simulations

10.1007/BF00741422

Upadhya K., 1988, Am. Ceram. Soc. Bull., 67, 1691

Westwood , A. C. and Notis , M. R. Materials Research Society Symposium Proceedings, Vol. 167, Advanced Electronic Packaging Materials. pp.265Pittsburgh, Pennsylvania: Materials Research Society.