Advances in lead-free electronics soldering
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Tài liệu tham khảo
2000, Proposal for a Directive of the European Parliament and of the Council on Waste Electrical and Electronic Equipment and on the restriction of the use of certain hazardous substances in electrical and electronic equipment, COM, 347
1997
Harrison, 1999, IDEALS: Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering, 98
2000
Wood, 1994, In search of new lead-free electronics solders, J Electron Mater, 23, 709, 10.1007/BF02651363
2000
Suganuma, 2000, Development of lead-free soldering and practice, Denshi-zairyou, 4, 56
Hua, 1999, Eutectic Sn–Bi as an alternative Pb-free solder, S/03/8/1/6
Yamagishi, 1999, Step soldering with low temperature solders, 54
1990
1995
Suganuma, 1995, Microstructure and strength of interface between Sn–Ag eutectic solder and Cu, J Jpn Inst Metals, 59, 1299, 10.2320/jinstmet1952.59.12_1299
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Loomans, 2000, Silver copper eutectic temperature and composition, J Electron Mater, 31A, 1155
Moon KW, Boettinger WJ, Kattner UR, Biancaniello FS, Handwerker CA. Experimental and thermodynamic assessment of Sn–Ag–Cu solder alloys. J Electron Mater 2000;27:in press.
Vianco, 1999, Properties of ternary Sn–Ag–Bi solder alloys. Part II. Wettability and mechanical properties analyses, J Electron Mater, 28, 1138, 10.1007/s11664-999-0251-3
Artaki, 1994, Evaluation of lead-free solder joints in electronic assemblies, J Electron Mater, 23, 757, 10.1007/BF02651370
Kattner, 1994, On the Sn–Bi–Ag ternary phase diagrams, J Electron Mater, 23, 603, 10.1007/BF02653345
Ohnuma, 1999, Thermodynamic database for phase diagrams in micro-soldering alloys, J Electron Mater, 28, 1164, 10.1007/s11664-999-0152-5
Hwang, 2000, High temperature stability of lead-free soldering interfaces
Korhonen, 1998, Thermodynamics of the Sn–In–Ag solder system, J Electron Mater, 27, 149, 10.1007/s11664-998-0205-1
Lee, 1996, Thermodynamic assessments of the Sn–In and Sn–Bi systems, J. Electron Mater, 25, 983, 10.1007/BF02666734
Ohtani, 1994, A thermodynamic of the phase equilibria in the Bi–Sn–Sb system, J Electron Mater, 23, 747, 10.1007/BF02651369
Ghosh, 1994, An investigation of phase equilibria of the Bi–Sb–Sn system, J Electron Mater, 23, 619, 10.1007/BF02653347
Yoon, 1999, Investigation of the phase equilibria in the Sn–Bi–In alloy system, Metall Trans A, 30A, 1503, 10.1007/s11661-999-0087-8
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Yoon, 1998, A thermodynamic study of phase equilibria in the Sn–Bi–Pb system, Calphad, 22, 167, 10.1016/S0364-5916(98)00022-4
Lee, 1996, Thermodynamic assessments of the Sn–Zn and In–Zn binary systems, Calphad, 20, 471, 10.1016/S0364-5916(97)00009-6
Yoon, 1997, Thermodynamic-aided alloy design and evaluation of Pb-free solder, Sn–Bi–In–Zn system, Acta Mater, 45, 951, 10.1016/S1359-6454(96)00253-4
Loomans, 1994, Investigation of multicomponent lead-free solder, J Electron Mater, 23, 741, 10.1007/BF02651368
Nakase, 1996, Properties of Sn–Ag binary alloy as lead free solder and interface microstructure with Cu, J Jpn Inst Interconnect Packaging Electronic Circuits, 11, 506, 10.5104/jiep1995.11.506
Suganuma, 1998, Wetting and interface microstructure between Sn–Zn binary alloys and Cu, J Mater Res, 13, 2859, 10.1557/JMR.1998.0391
Shoji, 1999, Highly reliable solder paste of Sn–Zn alloy system, S/03/7/1/7
Lin, 1998, The microstructures of the Sn–Zn–Al solder alloys, J Electron Mater, 27, 97, 10.1007/s11664-998-0197-x
Suganuma, 2000, Heat resistance of Sn–9Zn solder/Cu interface with or without coating, J Mater Res, 15, 884, 10.1557/JMR.2000.0126
Chen, 1999, Interfacial reactions in Ag–Sn/Cu couples, J Electron Mater, 28, 1203, 10.1007/s11664-999-0158-z
Lee, 1998, Thermodynamic prediction of interface phases at Cu/solder joints, J Electron Mater, 27, 1161, 10.1007/s11664-998-0065-8
Lee, 1997, Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation, Acta Mater, 45, 1867, 10.1016/S1359-6454(96)00325-4
Yu, 2000, The adhesion strength of a lead-free solder hot-dipped on copper substrate, J Electron Mater, 29, 237, 10.1007/s11664-000-0149-6
Lin, 1998, Wetting interaction of Pb free Sn–Zn–Al solders on metal plated substrate, J Electron Mater, 27, 1205, 10.1007/s11664-998-0070-y
Minor, 2000, Growth of a Au–Ni–Sn intermetallic compound on the solder-substrate interface after aging, Metall Trans A, 31A, 798, 10.1007/s11661-000-0022-5
Ghosh, 1998, Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium, J Electron Mater, 27, 1154, 10.1007/s11664-998-0064-9
Vianco, 1994, Solid-state intermetallic compound growth between copper and high temperature, tin-rich solders. I. Experimental analysis. II. Modeling, J Electron Mater, 23, 721, 10.1007/BF02651365
Vianco, 1994, Intermetallic compound layer formation between copper and hot dipped 100 In, 50In–50Sn, 100 Sn, and 63Sn–37Pb coatings, J Electron Mater, 23, 583, 10.1007/BF02653343
Vianco, 1999, Properties of ternary Sn–Ag–Bi solder alloys. I. Thermal properties and microstructural analysis, J Electron Mater, 28, 1127, 10.1007/s11664-999-0250-4
Yang, 1994, Microstructure evolution of eutectic Sn–Ag solder joints, J Electron Mater, 23, 765, 10.1007/BF02651371
Kang, 1996, Interfacial reactions during soldering with lead–tin eutectic and lead(Pb)-free, tin rich solders, J Electron Mater, 25, 1113, 10.1007/BF02659912
Shaefer, 1998, Theory for intermetallic phase growth between Cu and liquid Sn–Pb solder based on grain boundary diffusion control, J Electron Mater, 27, 1167, 10.1007/s11664-998-0066-7
Chada, 1999, An improved numerical method for predicting intermetallic layer thi9ckness developed during the formation of solder joints on Cu substrates, J Electron Mater, 28, 1194, 10.1007/s11664-999-0157-0
Vincent, 1994, Lead-free solders for electronic assembly, GEC J Res, 11, 76
Artaki, 1995, Wave soldering with lead-free solders, Proc Surf Mount Int, 1, 495
Suganuma, 1998, Microstructural features of lift-off phenomenon in through-hole circuit soldered by Sn–Bi alloy, Scripta Mater, 38, 1333, 10.1016/S1359-6462(98)00059-1
Suganuma, 1999, Influence of various factors on lift-off phenomenon in wave soldering with Sn–Bi alloy, Jpn Inst Electron Packag, 2, 116, 10.5104/jiep.2.116
Takao, 1999, Influence of alloy composition on lift-off phenomenon in tin binary alloys, 381
Balley, 1998, Numerical modeling of solder joint formation, Sold Surf Mount Technol, 10, 6, 10.1108/09540919810219912
Suganuma, 2000, Lift-off phenomenon in wave soldering, Acta Materialia, 48, 4475, 10.1016/S1359-6454(00)00234-2
Suganuma, 1999, Influence of various factors on lift-off phenomenon in wave soldering, 505
Suganuma, 2000, Mechanism and prevention of lift-off in lead-free soldering, 303
Morris Jr, 1993, Microstructure and mechanical properties of Sn–In and Sn–Bi solders, J Metals, 45, 25
Glazer, 1994, Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review, J Electron Mater, 23, 693, 10.1007/BF02651361
McCormack, 1997, Significantly Improved mechanical properties of Bi–Sn solder alloys by Ag-doping, J Electron Mater, 26, 954, 10.1007/s11664-997-0281-7
Mavoori, 1997, Creep, stress relaxation, and plastic deformation in Sn–Ag and Sn–Zn eutectic solders, J Electron Mater, 26, 783, 10.1007/s11664-997-0252-z
Mitlin, 1999, Solid solution creep behavior of Sn–xBi alloys, Metal Trans A, 30A, 115, 10.1007/s11661-999-0199-1
Reinikainen, 1999, Deformation behavior of dilute SnBi(0.5 to 6 at.pect) solid solutions, Metal Trans A, 30A, 123, 10.1007/s11661-999-0200-z
Igshev, 2000, Creep phenomena in lead-free solders, J Electron Mater, 29, 244, 10.1007/s11664-000-0150-0
Kariya, 1998, Mechanical fatigue characteristics of Sn–3.5Ag–X (X=Bi, Cu, Zn and In) solder alloys, J Electron Mater, 27, 1229, 10.1007/s11664-998-0074-7
Kariya, 1998, Effect of Bi on the isothermal fatigue properties of Sn–3.5 mass%Ag solder alloy, J Electron Mater, 27, 866, 10.1007/s11664-998-0111-6
Kariya, 1999, Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn–3.5Ag–X (X=Bi and Cu) solder joints, J Electron Mater, 28, 1263, 10.1007/s11664-999-0166-z
Komatsu, 1998, Mechanical properties of tin–zinc system lead-free solder, 93
Liu, 2000, Influence of microstructure on fatigue crack growth behavior of Sn–Ag solder interfaces, J Electron Mater, 29, 622, 10.1007/s11664-000-0056-x
McCormack, 1994, Improved mechanical properties in new, Pb-free solder alloys, J Electron Mater, 23, 715, 10.1007/BF02651364
Huh, 2000, Effect of Ag, Au content on mechanical and structural properties of Sn–Cu lead-free solder, 229