A tapered hollow metallic microneedle array using backside exposure of SU-8

Journal of Micromechanics and Microengineering - Tập 14 Số 4 - Trang 597-603 - 2004
Kabseog Kim1, Daniel S. Park1, Hong Lu1, Woo Seong2, Kyong‐Hwan Kim3, Jeong‐Bong Lee1, Chong H. Ahn4
1Erik Jonsson School of Engineering and Computer Science, The University of Texas at Dallas, Richardson, TX 75083, USA
2School of Information Engineering, Tongmyung University of Information Technology, Busan, Korea
3Department of Electric and Information Engineering, Kyungwon University, Seongnam, Korea
4Department of Electrical Engineering and Computer Science, University of Cincinnati, Cincinnati, OH 45221, USA

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Thông tin xuất bản

Journal of Micromechanics and Microengineering

Tập 14 Số 4

597-603

Thông tin tác giả