Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions

Acta Materialia - Tập 60 - Trang 5125-5134 - 2012
M.S. Park1, M.K. Stephenson1, C. Shannon1, L.A. Cáceres Díaz2, K.A. Hudspeth1, S.L. Gibbons1, J. Muñoz-Saldaña2, R. Arróyave1,3
1Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843, USA
2CINVESTAV, Unidad Querétaro, Fraccionamiento Juriquilla, Querétaro, Querétaro, Mexico
3Materials Science and Engineering Program, Texas A&M University, College Station, TX 77843, USA

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