Effect of intermetallic compound thickness on shear strength of 25 μm diameter Cu-pillars

Intermetallics - Tập 51 - Trang 37-47 - 2014
Julien Bertheau1,2,3, Fiqiri Hodaj2, Nicolas Hotellier3, Jean Charbonnier1
1CEA, LETI, MINATEC Campus, 17 rue des Martyr, 38054 Grenoble Cedex 09, France
2SIMaP – UMR CNRS 5266, Grenoble INP – UJF, BP 75, F-38402 Saint Martin d'Hères, France
3STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France

Tài liệu tham khảo

Sakuma, 2007, 3D chip stacking technology with low-volume lead-free interconnections, 627 Yu, 2009, Study of 15 μm pitch solder microbumps for 3D IC integration, 6 Wright, 2006, Characterization of micro-bump C4 interconnects for Si-carrier SOP applications, 633 Gan, 2006, Pb-free micro-joints (50 μm pitch) for the next generation micro-systems: the fabrication, assembly and characterization, 1210 Laurila, 2005, Interfacial reactions between lead-free solders and common base materials, Mater Sci Eng R, 49, 1, 10.1016/j.mser.2005.03.001 Huang, 2008, Intermetallic formation of copper pillar with Sn–Ag–Cu for flip-chip-on-module packaging, Transac Comp Packag Technol, 31, 767, 10.1109/TCAPT.2008.2001194 Borgesen, 2011, Assessing the risk of “Kirkendall voiding” in Cu3Sn, Microelectron Reliab, 51, 837, 10.1016/j.microrel.2010.11.014 Zeng, 2005, Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability, J Appl Phys, 97, 024508, 10.1063/1.1839637 Kim, 2008, Intermetallic compound and Kirkendall void growth in Cu pillar bump during annealing and current stressing, 336 Wang, 2009, Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates, Microelectron Reliab, 49, 248, 10.1016/j.microrel.2008.09.010 Mei, 2005, Kirkendall voids at Cu/solder interface and their effects on solder joint reliability, 415 Li, 2011, Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process, Acta Mater, 59, 1198, 10.1016/j.actamat.2010.10.053 Sweatman, 2008, Strength of lead-free BGA spheres in high speed loading, 127 Chuang, 2012, Elimination of voids in reactions between Ni and Sn: a novel effect of silver, Scr Mater, 66, 171, 10.1016/j.scriptamat.2011.10.032 Yu, 2008, Development of fine pitch solder microbumps for 3D chip stacking, 387 Kim, 2010, Intermetallic compound growth and reliability of Cu pillar bumps under current stressing, J Electron Mater, 39, 2281, 10.1007/s11664-010-1324-z Lee, 2011, Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration, 1468 Tsukamoto, 2011, The influence of solder composition on the impact strength of lead-free solder ball grid array joints, Microelectron Reliab, 51, 657, 10.1016/j.microrel.2010.10.012 Kim, 2006, Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application, Microelectron Reliab, 46, 535, 10.1016/j.microrel.2005.06.008 Koo, 2007, Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging, Microelectron Reliab, 47, 2169, 10.1016/j.microrel.2006.09.043 Williamson, 2007, Rate dependent strengths of some solder joints, J Phys D Appl Phys, 40, 4691, 10.1088/0022-3727/40/15/051 Koo, 2008, Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages, Mater Sci Eng A, 483–484, 620, 10.1016/j.msea.2006.11.164 Tian, 2011, Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing, Mater Sci Eng A, 529, 468, 10.1016/j.msea.2011.09.063 Kim, 2005, Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints, Mater Sci Technol, 21, 373, 10.1179/174328405X29258 Song, 2007, Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests, 364 Jing, 2011, Brittle versus ductile failure of a lead-free single solder joint specimen under intermediate strain rate, IEEE Transac Comp Packag Manuf Technol, 1, 1456, 10.1109/TCPMT.2011.2146259 Kim, 2008, Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints, J Alloys Compd, 458, 253, 10.1016/j.jallcom.2007.04.042 Chen, 2013, Single-joint shear strength of micro Cu pillar solders bumps with different amounts of intermetallics, Microelectron Reliab, 53, 47, 10.1016/j.microrel.2012.06.116 Bertheau, 2013, Reflow processes in micro-bumps studied by synchrotron X-ray projection nanotomography, Microelectron Eng, 113, 123, 10.1016/j.mee.2013.07.013 Sobczak, 2007, Factors affecting wettability and bond strength of solder joint couples, Pure Appl Chem, 79, 1755, 10.1351/pac200779101755 Boettinger, 1992, On wetting of the intermetallics Cu6Sn5 and Cu3Sn by Pb–Sn alloys, 183 Martin, 2013, Three-dimensional imaging of copper pillars using x-ray tomography within a scanning electron microscope: a simulation study based on synchrotron data, Rev Sci Instrum, 84, 023708, 10.1063/1.4792377 Zeng, 2002, Six cases of reliability study of Pb-free solder joints in electronic packaging technology, Mater Sci Eng R, 38, 55, 10.1016/S0927-796X(02)00007-4 Suh, 2008, Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper, Acta Mater, 56, 1075, 10.1016/j.actamat.2007.11.009 Deng, 2004, Young's modulus of (Cu, Ag)–Sn intermetallics measured by nanoindentation, Mater Sci Eng A, 364, 240, 10.1016/j.msea.2003.08.032 Howe, 1993, Bonding, structure and properties of metal-ceramic interfaces. 1. Chemical bonding, chemical reaction, and interfacial structure, Int Mater Rev, 38, 233, 10.1179/imr.1993.38.5.233 Eustathopoulos, 1999, Wettability at high temperatures, vol. 3