Properties and curing kinetics of C21-based reactive polyamides as epoxy-curing agents derived from tung oil

Ward, B. F., Force, C. G., Bills, A. M. & Woodward, F. E. Preparation and surface-active properties of the sodium soaps, mono-and diethanolamides and diol and triol sulfates of cycloaliphatic C21 Di- and C22 tricarboxylic acids. J. Am. Oil chem. Soc. 52, 219 (1975).

Vijayalakshmi, P., Subbarao, R. & Lakshminarayana, G. Kinetics of reaction of C21 cycloaliphatic dicarboxylic acid and ethylenediamine. J. Am. Oil chem. Soc. 65, 939 (1988).

Tramount, Y. A. & Charleston, S. C. Method for production of dicarboxylic acid and lactone. U.S. Patent: 5136055 (1992).

Vijayalakshmi, P., Chandrasekhara Rao, T., Kale, V., Balakrishna, R. S. & Subbarao, R. Reactive polyamides from cycloaliphatic C21 dicarboxylic acid and their evaluation as epoxy curing agents. Polymer 33, 3252 (1992).

Zhang, Z., Liang, G., Ren, P. & Wang, J. Curing behavior of Epoxy/POSS/DDS hybrid systems. Polym. Composite. 29, 77 (2007).

Omrani, A., Simon, L. C., Rostami, A. A. & Ghaemy, M. Cure kinetics, dynamic mechanical and morphological properties of epoxy resin-Im6NiBr2 system. Eur. Polym. J. 44, 769 (2008).

Dai, Z., Li, Y., Yang, S., Zong, C., Lu, X. & Xu, J. Preparation, curing kinetics, and thermal properties of bisphenol fluorene epoxy resin. J. Appli. Polym. Sci. 106, 1476 (2007).

Teo, J. K. H., Teo, K. C., Pan, B., Xiao, Y. & Lu, X. Epoxy/polyhedral oligomeric silsesquioxane (POSS) hybrid networks cured with an anhydride: cure kinetics and thermal properties. Polymer 48, 5671 (2007).

Ngo, T. D., Tonthat, M. T., Hoa, S. V. & Cole, K. C Curing kinetics and mechanical properties of epoxy nanocomposites based on different organoclays. Polym. Eng. Sci. 47, 649 (2007).

Chiou, P. L. & Letton, A. Modelling the chemorheology of an epoxy resin system exhibiting complex curing behavior. Polymer 33, 3925 (1992).

Deng, Y. & Martin, G. C. Diffusion and diffusion-controlled kinetics during epoxy-amine cure. Macromolecules 27, 5147 (1994).

Rohr, D. F. & Klein, M. T. Modeling diffusion and reaction in epoxy-amine linear polymerization kinetics. Ind. Eng. Chem. Res. 27, 1361 (1988).

O' Brien, D. J. & White, S. R. Cure kinetics, gelation, and glass transition of a bisphenol F epoxide. Polym. Eng. Sci. 43, 863 (2003).

Wang, C. S. & Lin, C. H. Novel phosphorus containing epoxy resins II. curing kinetics. Polymer 41, 8579 (2000).

Salvador, M. & Málek, J. Kinetic analysis of curing reaction in an epoxy resin. Thermochim. Acta. 228, 47 (1993).

Málek, J. The kinetic analysis of non iso-thermal data. Thermochim. acta. 200, 257 (1992).

Sbirrazzuoli, N., Girault, Y. & Eligant, L. The malek method in the kinectic study of polymerization by DSC. Thermochim. Acta. 249, 179 (1995).

Roşu, D., Caşcaval, C. N. & Mustaţǎ, F. Cure kinetics of epoxy resins studied by non-isothermal DSC data. Thermochim. Acta. 383, 257 (2002).

Yao, L., Deng, J., Qu, B. & Shi, W. Cure kinetics of DGEBA with hyperbranched Poly (3-hydroxyphenyl) phosphate as curing agent studied by non-isothermal DSC. Chem. Res. Chinese U. 22, 118 (2006).

Málek, J. A computer program for kinetic analysis of non-isothermal thermoanalytical data. Thermochim. Acta. 138, 337 (1989).

Xia, J., Wang, D., Nie, X. & Yang, X. Method for preparation of low molecular weight polyamides from tung oil, C. N. Patent: 1631938 (2006).

Barret, K. E. J. Determination of rates of thermal decomposition of polymerization initiators with a differential scanning calorimeter. J. Appl. Polym. Sci. 11, 1617 (1967).

Kissinger, H. E. Reaction kinetics in differential thermal analysis. Anal. Chem. 29, 1702 (1957).

Senum, G. I. & Yang, R. T. Rational approximations of the integral of the arrhenius function. J. Thermal. Anal. 11, 445 (1977).

Málek, J. Kinetic analysis of crystallization processes in amorphous materials. Thermochim. Acta. 355, 239 (2000).

Šesták, J. & Berggren, G. Study of the kinetics of the mechanism of solid-state reactions at increasing temperatures. Thermochim. Acta. 1, 1 (1971).