Computational study and experimental comparison of the in-flight particle behavior for an external injection plasma spray process

K. Remesh1, S. C. M. Yu1, H. W. Ng1, C. C. Berndt2
1School of Mechanical & Production Engineering, Nanyang Technological University, Singapore
2Department of Materials Science and Engineering, Stony Brook University, Stony Brook

Tóm tắt

A three-dimensional computational fluid dynamic (CFD) analysis using Fluent V5.4 was conducted on the in-flight particle behavior during the plasma spraying process with external injection. The spray process was modeled as a steady jet issuing from the torch nozzle via the heating of the are gas by an electric are within the nozzle. The stochastic discrete model was used for the particle distribution. The particle temperature, velocity, and size inside the plasma plume at a specified standoff distance have been investigated. The results show that carrier gas flow rate variation from 2 standard liters per minute (slm) to 4.0 slm can increase the centerline particle mean temperature and mean velocity by 10% and 16%, respectively, at the specified standoff distance. A further increase of the carrier gas flow rate to 6 slm did not change the particle temperature, but the particle velocity was decreased by 20%. It was also found that an increase in the total arc gas flow rate from 52 slm to 61 slm, with all other process parameters unchanged, resulted in a 17% higher particle velocity, but 6% lower particle temperature. Some of these computational findings were experimentally confirmed by Kucuk et al. For a given process parameter setting, the kinetic and thermal energy extracted by the particles reached a maximum for carrier gas flow rate of about 3.5–4.0 slm.

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Tài liệu tham khảo

A. Kucuk, R.S. Lima, and C.C. Berndt: Influence of Plasma Spray Parameters on In-Flight Characteristics of ZrO2-8 wt.% Y2O3 Ceramic Particles,” J. Am. Ceram. Soc., 2001, 84(4), pp. 685–92.

Y.P. Wan, V. Prasad, G.-X. Wang, S. Sampath, and J.R. Fincke: “Model and Powder Particle Heating, Melting, Resolidification, and Evaporation in Plasma Spraying Processe,” J. Heat Trans., 1999, 121, pp. 691–99.

I. Ahmed and T.L. Bergman: “Simulation of Thermal Plasma Spraying of Partially Molten Ceramics: Effects of Carrier Gas on Particle Deposition and Phase Change Phenomena,” J. Heat Trans., 2001, 123(1), pp. 188–96.

C.B. Ang, H.W. Ng, S.C.M. Yu, and Y.C. Lam: “A Process Control Methodology for DC Plasma Spraying,” Plasma Chem. Plasma Process.,” 2000, 20(3), pp. 325–42.

C.B. Ang, A. Devasenapathi, H.W. Ng, S.C.M. Yu, and Y.C. Lam: “A Proposed Process Control Chart for DC Plasma Spraying Process—Part II: Experimental Verification for Spraying Alumina,” Plasma Chem. Plasma Process., 2001, 21(3), pp. 401–19.

R.L. Williamson, J.R. Fincke, and C.H. Chang: “A Computational Examination of the Sources of Statistical Variances in Particle Parameters During Thermal Plasma Spraying,” Plasma Chem. Plasma Process., 2000, 20(3), pp. 299–324.

The Fluent User’s Guide, 2000, Chapter 8, Fluent Inc., Lebanon, NH 03766.

M.I. Boulos, P. Fauchais, and E. Pfender: Thermal Plasmas: Fundamentals and Application, Vol. 1, Plenum Press: New York, NY, 1994.

J.F. Bisson, B. Gauthier, and C. Moreau: “Effect of Plasma Fluctuations on In-Flight Particle Parameters” in Thermal Spray 2001: New Surfaces for a New Millennium, Singapore, ASM International, Materials Park, OH, 2001.

M. Vardelle, A. Vardelle, and P. Fauchais: “Spray Parameters and Particle Behavior Relationships During Plasma Spraying,” J. Therm. Spray Technol., 1993, 2(1), pp. 79–91.

C.H. Chang and J.D. Ramshaw: “Numerical Simulations of Argon Plasma Jet Flowing Into Cold Air,” Plasma Chem. Plasma Process., 1993, 13(2), pp. 189–209.

L.-S. Fan and C. Zhu: Principles of Gas-Solid Flows, Cambridge, UK, Cambridge University Press, 1998.

E. Bourdin and P. Fauchais: “Transient Heat Conduction Under Plasma Conditions,” Int. J. Heat Mass Trans., 1983, 26(4), pp. 567–82.

S.A. Morsi and A.J. Alexander: “An Investigation of Particle Trajectories in Two-Phase Flow Systems,” J. Fluid Mech., 1972, 55(2), pp. 193–208.

W.E. Ranz and W.R. Marshall: “Evaporation From Drops,” Chem. Eng. Prog., 1952, 48(3), pp. 141–73.

S.V. Patankar: Numerical Heat Transfer, Hemisphere Publishing Corporation, Washington, DC, 1980.

Anon: Tech-Report Metco 204NS Yttria Stabilized Zirconia Powder, Metco, Westbury, NY, 1985.

J.F. Shackelford and W. Alexander, ed.: The CRC Material Science and Engineering Hand Book, CRC Press, Boca Raton, 1994.

L. Pouliot, P.J. Blain, and F. Nadeau: DPV-2000 Reference Manual, Tecnar Automation, St. Hubert, Canada, 1999.

K. Remesh, H.W. Ng, and S.C.M. Yu: “Influence of Process Parameters on the Deposition Footprint in Plasma Spray Coating,” J. Therm Spray Tech., 2003, 12(3), pp. 377–392.