The mechanical properties of the SiOC(H) composite thin films with a low dielectric constant
Tài liệu tham khảo
Morgen, 2000, Annu. Rev. Mater. Sci., 30, 651, 10.1146/annurev.matsci.30.1.645
Kim, 1996, Appl. Phys. Lett., 68, 1507, 10.1063/1.115681
Endo, 1999, J. Appl. Phys., 86, 2739, 10.1063/1.371119
Gill, 1999, J. Appl. Phys., 85, 3314, 10.1063/1.369391
Banerjee, 1999, J. Electrochem. Soc., 146, 2219, 10.1149/1.1391917
Jing, 2001, JKPS, 41, 769
Kim, 2001, J. Appl. Phys., 90, 2469, 10.1063/1.1388861
Kim, 2000, J. Vac. Sci. Technol. A, 18, 1216, 10.1116/1.582328
Hacker, 1997, MRS Bull., 22, 33, 10.1557/S0883769400032310
Y.H. Kim, Deposition and characterization of low-dielectric-constant SiOC thin films for interlayer dielectrics of multilevel interconnection, Ph.D. thesis submitted to the Graduate School of Seoul National University, 2002
Jing, 2001, JKPS, 39, S302
Sen, 1997, Phys. Rev., B15, 4030
Lucovsky, 1979, Philos. Mag. B, 39, 513, 10.1080/13642817908246002
Bost, 2001, Thin Solid Films, 385, 281, 10.1016/S0040-6090(00)01925-8
Grill, 2001, Appl. Phys. Lett., 79, 803, 10.1063/1.1392976