Tensile, fracture toughness, and fatigue crack growth rate properties of zirconium copper
Tóm tắt
Room-temperature tensile, fracture toughness, and fatigue crack growth rate (FCGR) properties were developed on high-conductivity (94% IACS), 0.17 wt% zirconium copper (solution annealed, quenched, warm-worked, and aged). Longitudinal and transverse 0.2 pet offset yield strengths of this zirconium copper equaled 36.2 and 38.6 ksi (250 and 266 MPa), respectively. The average room temperature fracture toughness was superb at 382 ksi √in (423 MPa √m); the tearing modulus averaged 438 (nondimensional), and, as such, zirconium copper should be stable against tearing mechanisms for all crack configurations. The growth rate of fatigue cracks in zirconium copper was approximately 1 order of magnitude slower than in annealed pure copper. Consequently, zirconium copper proved to be an attractive material from both electrical conductivity and structural material properties standpoints.
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