Nanotwinned Microstructure Engineering of Electroplated Copper for Enhanced Anti-corrosion in Alkaline Medium
Tóm tắt
Electroplated copper is a key electronic interconnect material in integrated circuits and printed circuits and inevitably exposed to corrosive media in manufacturing processes. The present work reports, for the first time, that corrosion resistance of electroplated copper in 4 wt% NaOH is enhanced via nanotwinned microstructure engineering. Nucleation and growth of oxide/hydroxide on nanotwinned copper are inhibited, attributed to existence of highly (111)-preferred grain orientation and high-density parallelly-aligned coherent twin boundaries at surface. This study unveils a novel anti-corrosion strategy of nantowinned microstructure engineering against alkaline etchant, and exhibits great application values in industrial electroplating of copper, silver, or their alloys.
Tài liệu tham khảo
U.G. Stöckgen, S. Wehner, J. Heinrich, A. Kiesel, R. Liske, ECS Trans. 25, 3–17 (2019)
Y. Chen, W. He, X. Chen, C. Wang, Z. Tao, S. Wang, G. Zhou, M. Moshrefi-Torbati, Electrochim. Acta 120, 293–301 (2014)
W. Zhang, S.H. Brongersma, N. Heylen, G. Beyer, W. Vandervorst, K. Maex, J. Electrochem. Soc. 152, C832–C837 (2005)
P.-T. Lee, C.-H. Chang, C.-Y. Lee, Y.-S. Wu, C.-H. Yang, C.-E. Ho, Mater. Des. 206, 109830 (2021)
J.-H. Moon, J. Shin, T.-H. Kim, D. Song, E. Cho, J. Electroanal. Chem. 871, 114318 (2020)
J. Li, G. Zhou, Y. Hong, C. Wang, W. He, S. Wang, Y. Chen, Z. Wen, Q. Wang, ACS Omega 5, 4868–4874 (2020)
C.-Y. Lee, P.-C. Lin, C.-H. Yang, C.-E. Ho, Surf. Coat. Technol. 386, 125471 (2020)
A. Varea, E. Pellicer, S. Pané, B.J. Nelson, S. Suriñach, M.D. Baró, J. Sort, Int. J. Electrochem. Sci. 7, 1288–1302 (2012)
F. Rosalbino, R. Carlini, F. Soggia, G. Zanicchi, G.J.C.S. Scavino, Corros. Sci. 58, 139–144 (2012)
T. Liu, S. Chen, S. Cheng, J. Tian, X. Chang, Y. Yin, Electrochim. Acta 52, 8003–8007 (2007)
K.M. Ismail, Electrochim. Acta 52, 7811–7819 (2007)
C. Lee, Y. Kim, R. Kim, B. Yoo, J.-K. Kim, J. Alloy. Compd. 846, 156488 (2020)
N. Murata, N. Saito, K. Tamakawa, K. Suzuki, H. Miura, J. Electron. Packag. 137, 0310001 (2015)
S. Daryadel, M. Minary-Jolandan, Mater. Lett. 280, 128584 (2020)
G. Kear, B.D. Barker, F.C. Walsh, Corros. Sci. 46, 109–135 (2004)
T. Kosec, J. Voglar, P. Močnik, A. Legat, Corros. Eng. Sci. Technol. 56, 728–735 (2021)
M. Guo, K. Daub, Q. Dong, F. Long, W.J. Binns, M.R. Daymond, D.W. Shoesmith, J.J. Noël, S.Y. Persaud, J. Electrochem. Soc. 169, 031509 (2022)
X. Liao, F. Cao, L. Zheng, W. Liu, A. Chen, J. Zhang, C. Cao, Corros. Sci. 53, 3289–3298 (2011)
B. Yu, P. Woo, U.J.S.M. Erb, Scripta Mater. 56, 353–356 (2007)
W. Luo, Y. Xu, Q. Wang, P. Shi, M. Yan, Corros. Sci. 52, 3509–3513 (2010)
W. Luo, L. Hu, Y. Xv, J. Zhou, W. Xv, M. Yan, Anti-Corros. Methods Mater. 67, 465–472 (2020)
Z. Zhang, S. Yang, P. Lv, Y. Li, X. Wang, X. Hou, Q. Guan, Appl. Surf. Sci. 294, 9–14 (2014)
S.J. Kim, Y.I. Kim, B. Lamichhane, Y.H. Kim, Y. Lee, C.R. Cho, M. Cheon, J.C. Kim, H.Y. Jeong, T. Ha, J. Kim, Y.H. Lee, S.G. Kim, Y.M. Kim, S.Y. Jeong, Nature 603, 434–438 (2022)
L. Lu, Y. Shen, X. Chen, L. Qian, K. Lu, Science 304, 422–426 (2004)
R. Niu, K. Han, Y.-F. Su, T. Besara, T.M. Siegrist, X. Zuo, Sci. Rep. 6, 31410 (2016)
P.-C. Chiang, Y.-A. Shen, S.-P. Feng, C.-M. Chen, J. Electrochem. Soc. 167, 162516 (2021)
I.-H. Tseng, P.-N. Hsu, T.-L. Lu, K. Tu, C. Chen, Results Phys. 24, 104154 (2021)
Y. Zhao, I.C. Cheng, M.E. Kassner, A.M. Hodge, Acta Mater. 67, 181–188 (2014)
F.-L. Sun, L.-Y. Gao, Z.-Q. Liu, H. Zhang, T. Sugahara, S. Nagao, K. Suganuma, J. Mater. Sci. Technol. 34, 1885–1890 (2018)
F.-L. Sun, Z.-Q. Liu, C.-F. Li, Q.-S. Zhu, H. Zhang, K. Suganuma, Materials 11, 319 (2018)
D. Xu, W.L. Kwan, K. Chen, X. Zhang, V. Ozoliņš, K. Tu, Appl. Phys. Lett. 91, 254105 (2007)
Y.J. Li, K.N. Tu, C. Chen, Materials 13, 1310 (2020)
X. Zhan, J. Lian, H. Li, X. Wang, J. Zhou, K. Trieu, X. Zhang, Electrochim. Acta 365, 137391 (2021)
S.D. Giri, A. Sarkar, J. Electrochem. Soc. 163, H252–H259 (2016)
E. Martinez-Lombardia, Y. Gonzalez-Garcia, L. Lapeire, I. De Graeve, K. Verbeken, L. Kestens, J.M.C. Mol, H. Terryn, Electrochim. Acta 116, 89–96 (2014)