Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces

International Journal of Solids and Structures - Tập 42 - Trang 3918-3952 - 2005
Tarik Omer Ogurtani1, Ersin Emre Oren1
1Department of Metallurgical and Materials Engineering, Middle East Technical University, 06531 Ankara, Turkey

Tài liệu tham khảo