Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer

Journal of Materials Processing Technology - Tập 209 - Trang 2746-2752 - 2009
A. Elrefaey1, W. Tillmann1
1Institute of Materials Engineering, Faculty of Mechanical Engineering, Dortmund University of Technology, Germany

Tài liệu tham khảo

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