Nanoscale Wire Bonding of Individual Ag Nanowires on Au Substrate at Room Temperature

Nano-Micro Letters - Tập 9 - Trang 1-6 - 2017
Peng Peng1,2, Wei Guo1, Ying Zhu1, Lei Liu3, Guisheng Zou3, Y. Norman Zhou3,4
1School of Mechanical Engineering and Automation, Beihang University, Beijing, People’s Republic of China
2International Research Institute for Multidisciplinary Science, Beihang University, Beijing, People’s Republic of China
3Department of Mechanical Engineering, Tsinghua University, Beijing, People’s Republic of China
4Centre for Advanced Materials Joining, University of Waterloo, Waterloo, Canada

Tóm tắt

The controllable wire bonding of individual Ag nanowires onto a Au electrode was achieved at room temperature. The plastic deformation induced by pressure using nanoindentation could break the protective organic shell on the surface of the Ag nanowires and cause atomic contact to promote the diffusion and nanojoining at the Ag and Au interface. Severe slip bands were observed in the Ag nanowires after the deformation. A metallic bond was formed at the interface, with the Ag diffusing into the Au more than the Au diffused into the Ag. This nanoscale wire bonding might present opportunities for nanoscale packaging and nanodevice design.

Tài liệu tham khảo

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