Hall, S., Buiu, O., Mitrovic, I.Z., Lu, Y., et al., Review and perspective of high-k dielectrics on silicon, J. Telecomunic. Inform. Technol., 2007, vol. 2, p. 33.
Robertson, J. and Wallace, R.M., High-K materials and metal gates for CMOS applications, Mater. Sci. Eng.: R: Reports, 2015, vol. 88, p. 1.
Robertson, J. and Falabretti, B., Band offsets of high K gate oxides on III–V semiconductors, J. Appl. Phys., 2006, vol. 100, p. 014111.
Ribes, G., Mitard, J., Denais, M., Bruyère, S., et al., Review on high-k dielectrics reliability issues, IEEE Trans. Device Materials Reliab., 2005, vol. 5, no. 1, p. 5.
Robertson, J., High dielectric constant oxides, Eur. Phys. J. Appl. Phys., 2004, vol. 28, p. 265.
Wilk, G.D., Wallace, R.M., and Anthony, J.M., High-k gate dielectrics: Current status and materials properties considerations, J. Appl. Phys., 2001, vol. 89, no. 10, p. 5243.
Wallace, R.M. and Wilk, G., High-k gate dielectric materials, MRS Bull., 2002, vol. 27, no. 3, p. 192.
Fröhlich, K., Ťapajna, M., Rosová, A., Dobročka, E., et al., Growth of high-dielectric-constant TiO2 films in capacitors with RuO2 electrodes, Electrochem. Solid-State Lett., 2008, vol. 11, no. 6, p. G19.
Avis, C. and Jang, J., High-performance solution processed oxide TFT with aluminum oxide gate dielectric fabricated by a sol-gel method, J. Mater. Chem., 2011, vol. 21, p. 10649.
Kim, Y.S. and Yun, S.J., Nanolaminated Al2O3–TiO2 thin films grown by atomic layer deposition, J. Cryst. Growth, 2005, vol. 274, p. 3.
Akshara, P.C., Rajaram, G., and Krishna, M.G., Single composite target magnetron sputter deposition of crystalline and amorphous SiC thin films, Mater. Res. Express, 2018, vol. 5, p. 036410.
Nakano, J., Miyazaki, H., Kimura, T., Goto, T., et al., Thermal conductivity of yttria-stabilized zirconia thin films prepared by magnetron sputtering, J. Ceram. Soc. Jpn., 2004, vol. 112, p. 908.
Ries, S., Bibinov, N., Rudolph, M., Schulze, J., et al., Spatially resolved characterization of a dc magnetron plasma using optical emission spectroscopy, Plasma Sources Sci. Technol., 2018, vol. 27, p. 094001.
Panjan, M., Loquai, S., Klemberg-Sapieha, J.E., and Martinu, L., Non-uniform plasma distribution in dc magnetron sputtering: Origin, shape and structuring of spokes, Plasma Sources Sci. Technol., 2015, vol. 24, p. 065010.
Britun, N. and Hnilica, J., Optical spectroscopy for sputtering process characterization, J. Appl. Phys., 2020, vol. 127, p. 211101.
Golosov, D.A., Melnikov, S.N., and Dostanko, A.P., Calculation of the elemental composition of thin films deposited by magnetron sputtering of mosaic targets, Surf. Eng. Appl. Electrochem., 2012, vol. 48, no. 1, p. 52.
Goncharov, A.A., Evsyukov, A.N., Kostin, E.G., Stetsenko, B.V., et al., Synthesis of nanocrystalline titanium dioxide films in a cylindrical magnetron-type gas discharge and their optical characterization, Tech. Phys., 2010, vol. 80, no. 8, p. 127.
Jokela, S.J., Veryovkin, I.V., Zinovev, A.V., Elam, J.W., et al., Secondary electron yield of emissive materials for large-area micro-channel plate detectors: Surface composition and film thickness dependencies, Physics Procedia, 2012, vol. 37, p. 740.
Chen, C.C., Phase equilibria at Ti-Al interface under low oxygen pressure, Atlas J. Mater. Sci., 2014, vol. 1, no. 1, p. 1.
Dean, J.A. and Lange, N.A., Lange’s Handbook of Chemistry, New York: McGraw-Hill Education, 2005.