Graded nanostructured interfacial layers fabricated by high power pulsed magnetron sputtering — plasma immersion ion implantation and deposition (HPPMS–PIII&D)
Tài liệu tham khảo
Butler, 2008, Nature, 454, 558, 10.1038/454558a
Chmiola, 2010, Science, 328, 480, 10.1126/science.1184126
Sayer, 1990, Science, 247, 1056, 10.1126/science.247.4946.1056
Chhowalla, 2000, Nature, 407, 164, 10.1038/35025020
Costescu, 2004, Science, 303, 989, 10.1126/science.1093711
Reiner, 2009, Science, 323, 1018, 10.1126/science.1169058
Floro, 2002, MRS Bull., 27, 19, 10.1557/mrs2002.15
Pocivavsek, 2008, Science, 320, 912, 10.1126/science.1154069
Singh, 1996, Science, 272, 396, 10.1126/science.272.5260.396
Li, 2010, ACS Appl. Mater. Interfaces, 2, 335, 10.1021/am9007159
Conrad, 1987, J. Appl. Phys., 62, 4591, 10.1063/1.339055
Sun, 2003, Appl. Surf. Sci., 206, 53, 10.1016/S0169-4332(02)01116-9
Anders, 1997, Surf. Coat. Technol., 93, 158, 10.1016/S0257-8972(97)00037-6
Wang, 2008, Rev. Sci. Instrum., 79, 023306, 10.1063/1.2870088
Sanders, 2000, Surf. Coat. Technol., 133–134, 78, 10.1016/S0257-8972(00)00879-3
Bales, 1990, Science, 249, 264, 10.1126/science.249.4966.264
Kouznetsov, 1999, Surf. Coat. Technol., 122, 290, 10.1016/S0257-8972(99)00292-3
Ehiasarian, 2007, Plasma Processes Polym., 4, S309, 10.1002/ppap.200730806
Wu, 2011, Rev. Sci. Instrum., 69, 033511, 10.1063/1.3565175
X.B. Tian, Z.Z. Wu, C.Z. Gong, China Patent, CN, 201010213894.4, 06(2010).
R.W.P. McWhirter, R.G. Huddlestone, S.L. Leonard, New York: Academic Press, 208(1965).
Christie, 2006, Czech. J. Phys., 56, B93, 10.1007/s10582-006-0183-6
Anders, 2010, J. Vac. Sci. Technol. A, 28, 783, 10.1116/1.3299267
Lattemann, 2006, Surf. Coat. Technol., 200, 6495, 10.1016/j.surfcoat.2005.11.082
Gautier, 1996, Surf. Coat. Technol., 254, 86
He, 2000, J. Vac. Sci. Technol. A, 18, 30, 10.1116/1.582154
Bull, 2006, Tribol. Int., 39, 99, 10.1016/j.triboint.2005.04.013
Anders, 2002, Surf. Coat. Technol., 156, 3, 10.1016/S0257-8972(02)00066-X
Oliveira, 2008, Phys. Stat. Sol. (c), 5, 893, 10.1002/pssc.200778307
Reinhard, 2007, Thin Solid Films, 515, 3685, 10.1016/j.tsf.2006.11.014