The Organometallic Chemical Vapor Deposition of Transition Metal Carbides: The Use of Homoleptic Alkyls

Springer Science and Business Media LLC - Tập 327 - Trang 127-132 - 1993
Matthew D. Healy1, David C. Smith1, Rodrigo R. Rubiano2, Robert W. Springer3, John E. Parmeter4
1CST-3, MS-C346, Los Alamos National Laboratory, Los Alamos, USA
2Dept. of Nuclear Eng., Massachusetts Institute of Technology, Cambridge, USA
3MST-7, MS-E549, Los Alamos National Laboratory, Los Alamos, USA
4Dept, 1126, Sandia National Laboratories, Albuquerque, USA

Tóm tắt

The organometallic chemical vapor deposition (OMCVD) of transition metal carbides (M = Ti, Zr, Hf, and Cr) from tetraneopentyl-metal precursors has been carried out. Metal carbides can be deposited on Si, Al2O3, and stainless steel substrates from M[CH2C(CH3)3]4 at temperatures in the range of 300 to 750 °C and pressures from 10−2 to 10−4 Torr. Thin films have also been grown using a carrier gas (Ar, H2). The effects of variation of the metal center, deposition conditions, and reactor design on the resulting material have been examined by SEM, XPS, XRD, ERD and AES. Hydrocarbon fragments generated in the deposition chamber have been studied by in-situ mass spectrometry. Complimentary studies examining the UHV surface decomposition of Zr[CH2C(CH3)3]4 have allowed for a better understanding of the mechanism leading to film growth.

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