Enhanced saturation and subcooled boiling of FC-72 dielectric liquid
Tài liệu tham khảo
G. Xu, B. Guenin, M. Vogel, Extension of air cooling for high power processors, in: Proc. 9th Intersociety Conf. on Thermal Phenomena, vol. 1, 2004, pp. 186–193.
Knickerbocker, 2002, An advanced multichip module (MCM) for high-performance UNIX servers, IBM J. Res. Dev., 46, 779, 10.1147/rd.466.0779
Rainey, 2000, Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72, J. Heat Transfer, 122, 509, 10.1115/1.1288708
M. Arik, A. Bar-Cohen, Ebullient cooling of integrated circuits by Novec fluids, in: Proc. of the Pacific Rim Intersociety, Electronics Packaging Conf., Kauai, HI, 18–23 July 2001.
Mathews, 2003, Experimental investigations of spray/wall impingement, Atomization Sprays, 13, 223
M. El-Genk, J. Parker, Pool boiling in saturated and subcooled HFE-7100 dielectric fluid from a porous graphite surface, in: Proc. 9th Intersociety Conf. on Thermal Phenomena, vol. 1, 2004, pp. 655–662.
Y. Maydanik, S. Vershinin, M. Korukov, J. Octerbeck, Miniature loop heat pipes—a promising means for cooling electronics, in: Proc. 9th Intersociety Conf. on Thermal Phenomena, vol. 2, 2004, pp. 60–66.
X. Chen, K. Toh, T. Wong, J. Chai, D. Pinjala, O. Navas, H. Ganesh, V. Kripesh, Direct liquid cooling of a stacked MCM, in: Proc. 9th Intersociety Conf. on Thermal Phenomena, vol. 1, 2004, pp. 199–206.
Chang, 1998, Film boiling incipience at the departure from natural convection on flat, smooth surfaces, J. Heat Transfer, 120, 402, 10.1115/1.2824264
El-Genk, 2003, Saturation boiling of HFE-7100 from a copper surface, Simulating a microelectronic chip, Int. J. Heat Mass Transfer, 46, 1841, 10.1016/S0017-9310(02)00489-1
El-Genk, 2003, Combined effects of subcooling and surface orientation on pool boiling of HFE-7100 from a simulated electronic chip, J. Exp. Heat Transfer, 16, 281, 10.1080/08916150390242244
Peterson, 1994
Ivey, 1967, Relationships between bubble frequency, departure diameter, and rise velocity in nuclear boiling, Int. J. Heat Mass Transfer, 10, 1023, 10.1016/0017-9310(67)90118-4
Mikic, 1969, A new correlation of pool-boiling data including the effect of heating surface characteristics, J. Heat Transfer, 91, 245, 10.1115/1.3580136
Ramaswamy, 2002, High-speed visualization of boiling from an enhanced structure, Int. J. Heat Mass Transfer, 45, 4761, 10.1016/S0017-9310(02)00196-5
Ramilison, 1992, Surface factors influencing burnout on flat heaters, J. Heat Transfer, 114, 287, 10.1115/1.2911261
C. Baldwin, S. Bhavnani, R. Jaeger, Towards optimizing enhanced surfaces for passive immersion cooled heat sinks, in: Proc. Intersociety Conf. on Thermal and Thermotechnical Phenomena in Electronic Systems, 1998, pp. 399–407.
Kubo, 1999, Effects of size and number density of micro-reentrant cavities on boiling heat transfer from a silicon chip immersed in degassed and gas dissolved FC-72, J. Enhanced Heat Transfer, 6, 151, 10.1615/JEnhHeatTransf.v6.i2-4.80
J. Tehver, Influences of porous coating on the boiling burnout heat flux, in: B. Sunden et al. (Eds.), Recent Advances in Heat Transfer, Elsevier Science Publishers, 1992, pp. 231–242.
Chang, 1996, Heater orientation effects on pool boiling of microporous enhanced surfaces in saturated FC-72, J. Heat Transfer, 118, 937, 10.1115/1.2822592
Rainey, 2003, Effect of pressure, subcooling, and dissolved gas on pool boiling from microporous surfaces in FC-72, J. Heat Transfer, 125, 75, 10.1115/1.1527890
Chang, 1997, Enhanced boiling heat transfer from micro-porous surfaces: effects of a coating composition and method, Int. J. Heat Mass Transfer, 40, 4449, 10.1016/S0017-9310(97)00057-4
O’Connor, 1996, Gas-saturated pool boiling heat transfer from smooth and microporous surfaces in FC-72, J. Heat Transfer, 18, 662, 10.1115/1.2822683
Honda, 2002, Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron scale roughness, J. Heat Transfer, 124, 383, 10.1115/1.1447937
Wei, 2003, Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin-fins immersed in FC-72, Int. J. Heat Mass Transfer, 46, 4059, 10.1016/S0017-9310(03)00226-6
Liu, 2001, Pool boiling of FC-72 and HFE-7100, J. Heat Transfer, 123, 399, 10.1115/1.1285892
Watwe, 1997, Combined pressure and subcooling effects on pool boiling from a PPGA chip package, J. Electron. Packag., 119, 95, 10.1115/1.2792226
F. Arbelaez, S. Sett, R. Mahajan, An experimental study on pool boiling of saturated FC-72 in highly porous aluminum foams, in: Proc. of 34th National Heat Transfer Conf., vol. 1, 2000, pp. 759–767.
Marto, 1982, Pool boiling heat transfer from enhanced surfaces to dielectric fluids, J. Heat Transfer, 104, 292, 10.1115/1.3245086
You, 1990, Experimental investigation of nucleate boiling incipience with a highly wetting dielectric fluid (R-113), Int. J. Heat Mass Transfer, 33, 105, 10.1016/0017-9310(90)90145-K
Hong, 1997, Boiling characteristics of cylindrical heaters in saturated, gas saturated, and pure-subcooled FC-72, J. Heat Transfer, 119, 313, 10.1115/1.2824225
El-Genk, 2005, Enhanced boiling of HFE-7100 dielectric liquid on porous graphite, Energy Conversion Manage, 46, 2455, 10.1016/j.enconman.2004.11.012
Kutateladze, 1961, Boiling heat transfer, Int. J. Heat Mass Transfer, 4, 31, 10.1016/0017-9310(61)90059-X
J. O’Connor, Enhancement of pool boiling heat transfer in highly wetting dielectric liquids, Ph.D. Dissertation, University of Texas at Arlington, Arlington, TX, 1994.
A. McNiel, Pool boiling critical heat flux in a highly wetting liquid, Masters Thesis, University of Minnesota, Minneapolis, MN, 1992.
H. Ivey, D. Morris, On the relevance of the vapor–liquid exchange mechanisms for subcooled boiling heat transfer at high pressure, Report AEEW-R137, United Kingdom Atomic Energy Authority, Winfrith, England, 1962.