Magnetic nanoparticle-based solder composites for electronic packaging applications

Progress in Materials Science - Tập 67 - Trang 95-160 - 2015
Siyang Xu1, Ashfaque H. Habib1, Andrea D. Pickel1, Michael E. McHenry1
1Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, United States

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