3D-printing and advanced manufacturing for electronics

Progress in Additive Manufacturing - Tập 4 - Trang 245-267 - 2019
Alejandro H. Espera1,2, John Ryan C. Dizon1,3, Qiyi Chen1, Rigoberto C. Advincula1
1Department of Macromolecular Science and Engineering, School of Engineering, Case Western Reserve University, Cleveland, USA
2Electronics Engineering Department, School of Engineering and Architecture, Ateneo de Davao University, Davao City, Philippines
3College of Engineering and Architecture, Bataan Peninsula State University, Balanga, Philippines

Tóm tắt

Printed electronics currently holds a significant share in the electronics fabrication market due to advantages in high-throughput production and customizability in terms of material support and system process. The printing of traces and interconnects, passive and active components such as resistors, capacitors, inductors, and application-specific electronic devices, have been a growing focus of research in the area of additive manufacturing. Adaptation of new 3D-printing technologies and manufacturing methods, specifically for printed electronics, are potentially transformative in flexible electronics, wireless communications, efficient batteries, solid-state display technologies, etc. Other than printing new and reactive functional electronic materials, the functionalization of the printing substrates with unusual geometries apart from the conventional planar circuit boards will be a challenge. Building the substrate, printing the conductive tracks, pick-and-placing or embedding the electronic components, and interconnecting them, are fundamental fabrication protocols new 3D-printing systems should adopt for a more integrated fabrication. Moreover, designers and manufacturers of such systems will play an important role in scaling 3D-printed electronics from prototyping to high-throughput mass production. This review gives a groundwork for such understanding, defining methods and protocols, reviewing various 3D-printing methods, and describing the state-of-the-art in 3D-printed electronics and their future growth.

Tài liệu tham khảo

Nature (2018) “Electronic devices”. https://www.nature.com/subjects/electronic-devices. Accessed 24 Oct 2018 Research B (2017) “Global Electronics Components Market Sees Continued Growth (7.7% CAGR),” GlobeNewswire, 9 October 2017. https://globenewswire.com/news-release/2017/10/09/1142799/0/en/Global-Electronics-Components-Market-Sees-Continued-Growth-7-7-CAGR.html. Accessed 24 Oct 2018 Cook B, Tehrani B, Cooper J, Kim S, Tentzeris M (2015) Integrated printing for 2D/3D flexible organic electronic devices. Handbook of flexible organic electronics. Woodhead Publishing, Cambridge, pp 199–216 Weiderrecht G (2009) Handbook of nanofabrication. Elsevier, New York Mosses R, Brackenridge S (2003) A novel process for the manufacturing of advanced interconnects. Circuit World 29(3):18–21 Zhao D, Liu T, Lin Z, Zhang M, Liang R, Wang B (2012) Fabrication and characterization of aerosol-jet printed strain sensors for multifunctional composite structures. Smart Mater Struct 21(11):115008 Lu B, Li D, Tian X (2015) Development trends in additive manufacturing and 3D printing. Engineering 1:85–89, Shirasaki Y, Supran G, Bawendi M, Bulović V (2012) Emergence of colloidal quantum-dot light-emitting technologies. Nat Photonics 7:13–23 Dizon J, Espera A, Chen Q, Advincula R (2017) Mechanical characterization of 3D-printed polymers. Additive Manuf 20:44–67 Macdonald E, Salas R, Espalin D, Perez M, Aguilera E, Muse D, Wicker R (2014) 3D printing for the rapid prototyping of structural electronics. IEEE Access 2:234–242 Macdonald E (2012) Integrating stereolithography and direct print technologies for 3D structural electronics fabrication. Rapid Prototyping J Ahn B, Duoss E, Motala M, Guo X, Park S-I, Xiong Y, Yoon J, Nuzzo R, Rogers J, Lewis J (2009) Omnidirectional Printing of Flexible, Stretchable, and Spanning Silver Microelectrodes. Science 323(5921):1590–1593 Lewis J, Ahn B (2015) Three-dimensional printed electronics. Nature 518:42–43 NanoMarkets Report (2007) Printed electronics: a manufacturing technology analysis and capability forecast 2007. http://www.nanomarkets.net. Accessed 2 June 2017 All About Circuits (2017) Active vs passive devices. https://www.allaboutcircuits.com/textbook/semiconductors/chpt-1/active-versus-passive-devices/. Accessed 13 Jun 2017 Poole I (2017) What is SMT surface mount technology—tutorial. http://www.radio-electronics.com/info/data/smt/what-is-surface-mount-technology-tutorial.php. Accessed 25 Jun 2017 NanoMarkets L (2005) NanoMarkets printable electronics report 2005. http://www.nanomarket.net/ Gibson I, Rosen D, Stucker B (2009) Additive manufacturing technologies: 3D printing, rapid prototyping, and direct digital manufacturing. Springer, Berlin John (2010) ICF techniques, 31 May 2010. http://www.circuitstoday.com/ic-fabrication-techniques. Accessed 2 Jun 2017 Kunnari E, Valkama J, Keskinen M, Mansikkamaki P (2009) Environmental evaluation of new technology: printed electronics case study. J Cleaner Prod 17:791–799 Kipphan H (2011) Handbook of print media. Springer, Germany Océ D (2006) Printing, 10th ed. Océ Printing Systems GmbH, Poing Sekitani T, Noguchi Y, Zschieschang U, Klauk H, Someya T (2008) Organic transistors manufactured using inkjet technology with subfemtoliter accuracy. Proc Natl Acad Sci 105(13):4976–4980 Sridhar A, Blaudeck T, Baumann R (2011) Inkjet printing as a key enabling technology for printed electronics. Mater Matters 6(1):12–15 Wood V, Panzer M, Chen J, Bradley M, Halpert J, Bawendi M, Bulovic V (2009) Inkjet-printed quantum dot–polymer composites for full-color AC-driven displays. Adv Mater 21(21):1–5 Derby B (2010) Inkjet printing of functional and structural materials: fluid property requirements, feature stability, and resolution. Annu Rev Mater Res 40:395–414 Professional SPIE (2013) Chuck Hull: pioneer in stereolithography. https://spie.org/membership/spie-professional-magazine/spie-professional-archives-and-special-content/2013-january-spie-professional-archive/chuck-hull. Accessed 11 Jun 2017 Grimm T (2004) User’s guide to rapid prototyping. Society of Manufacturing Engineers, Dearborn Hull CW (1986) Apparatus for production of three-dimensional objects by stereolithography. US Patent 4,575,330, 11 March 1986 Melchels FPW, Feijen J, Grijpma DW (2010) A review on stereolithography and its applications in biomedical engineering. Biomaterials 31:6121–6130 Waterman N, Dickens P (1994) Rapid product development in the USA, Europe and Japan. World Class Design Manuf 1(3):27–36 Pham D, Gault R (1998) “A comparison of rapid prototyping technologies”. Int J Mach Tools Manuf 38:1257–1287 Campbell T, Williams C, Ivanova O, Garrett B (2011) Could 3D printing change the world? Atlantic Council, Washington Kazmer D (2001) Three-dimensional printing of plastics. In: Applied plastics engineering handbook—processing, materials, and applications, a volume in plastic design library, Elsevier, New York, pp 617–634 Sachs E, Cima M, Cornie J (1990) Three dimensional printing: rapid tooling and prototypes directly from CAD representation. CIRP Annals Manuf Technol 39(1):201–204 Mota C, Puppi D, Dinucci D, Gazzarri M, CHielleni F (2013) Additive manufacturing of star poly(ε-caprolactone) wetspun scaffolds for bone tissue engineering applications. J Bioact Compatib Polym 28(4):320–340 Lewis J (2006) Direct ink writing of 3D functional materials. Adv Funct Mater 16:2193–2204 de Leon A, Chen Q, Palaganas N, Palaganas J, Manapat J, Advincula R (2016) High performance polymer nanocomposites for additive manufacturing applications. React Funct Polym 103:141–155 Mortara L, Hughes J, Ramsundar PLF, Probert D (2009) Proposed classification scheme for direct wire technologies. Rapid Prototyping J 15(4):299–309 Hon K, Li L, Hutchings I (2008) Direct writing technology—advances and developments. CIRP Ann Manuf Technol 57(2):601–620 Perez K, Williams C (2013) Combining additive manufacturing and direct wire for integrated electronics—a review. In: 24th International solid freeform fabrication symposium—an additive manufacturing conference, Texas Hoerber J, Glasschroeder J, Pfeffer M, Schilp J, Zaeh M, Franke J (2014) Approaches for additive manufacturing of 3D electronic applications. Proc CIRP 17:806–811 Robinson CJ, Stucker B, Lopes AJ, Wicker R, Palmer JA (2006) Integration of direct-write (DW) and ultrasonic consolidation (UC) technologies to create advanced structures with embedded electrical circuitry. In: 17th solid freeform fabrication symposium, Texas Medina F, Lopes A, Inamdar A, Hennessey R, Palmer J, Chavez B, Davis D, Gallegos P, Wicker R (2005) Hybrid manufacturing: integrating direct write and stereolithography. In: Solid freeform fabrication symposium proceedings, Austin, TX Janaki Ram G, Yang Y, George J, Robinson C, Stucker B (2006) Improving Linear Weld Density in Ultrasonically Consolidated Parts. In: Solid freeform fabrication symposium proceedings, Austin, TX Masurtschak S, Friel R, Gillner A, Ryll J, Harris R (2014) Laser-machined microchannel effect on microstructure and oxide formation of an ultrasonically processed aluminum alloy. J Eng Mater Technol 137(1):011006 3D Printing Processes. https://3dprintingindustry.com/3d-printing-basics-free-beginners-guide/processes/. Accessed 16 Jul 2017 Manapat J, Chen Q, Ye P, Advincula R (2017) 3D printing of polymer nanocomposites via stereolithography. Macromol Mater Eng 302:1600553 Dizon J, Chen Q, Valino A, Advincula R (2018) Thermo-mechanical and swelling properties of three-dimensional-printed poly(ethylene glycol) diacrylate/silica nanocomposites. MRS Commun. https://doi.org/10.1557/mrc.2018.188 Gebhardt A (2007) Generative manufacturing processes, rapid prototyping–rapid tooling–rapid manufacturing. Carl Hanser, Munich Zaeh M, Glasschroeder J, Krol T, Schilp J (2011) Innovative solutions for increasing the quality of components at additive manufacturing. Utz, Munich Gibbson I, Rosen D, Stucker B (2010) Additive manufacturing technologies, rapid prototyping to direct digital manufacturing. Springer, New York Lee D, Oh J (2010) Inkjet printing of conductive Ag lines and their electrical and mechanical characterization. Thin Solid Films 518(22):6352–6356 Hedges M (2010) 3D aerosol jet printing—an emerging mid manufacturing. In: 9th International congress molded interconnect devices, Fuerth Teschler L (2015) Your next circuit design could be fabricated on a printer. http://www.powerelectronictips.com/your-next-circuit-design-could-be-fabricated-on-a-printer/. Accessed 22 Jun 2017 Krebs T (2010) Flexible circuits or printed circuit boards? Technology selection based on virtual prototypes. In: 9th International congress molded interconnect devices, Fuerth Frank J, Feldmann K, Fischer C (2009) Two approaches for the design of modeled interconnect devices (3D-MID). In: Proceedings 6th international conference on digital enterprise technology, Hongkong Falat T, Platek B, Felba J (2012) Sintering process of silver nanoparticles in ink-jet printed conductive microstructures—molecular dynamics approach. In: 13th International conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems Allen M (2011) Nanoparticle sintering methods and applications for printed electronics. In: Aalto University publication series, Helsinki Frank J (2013) Molded interconnect devices 3D-MID: materials, manufacturing, assembly and applications for molded circuit carriers. Carl Hanser, Munich Pfeffer M, Goth C, Craiovan D, Frank J (2011) 3D-Assembly of molded interconnect devices with standard smd pick & place machines using an active multi axis workpiece carrier. In: International symposium on assembly and manufacturing, IEEE, Tampere Miettinen J, Pekkanen V, Kaija K, Mansikkamaki P, Mantysalo J, Mantysalo M (2008) Inkjet printed system-in-package design and manufacturing. Microelectron J 39(12):1740–1750 editor OEA (2011) A roadmap for organic and printed electronics. Whitepaper-OE, Frankfurt Tseng H, Subramanian V (2011) All inkjet-printed, fully self-aligned transistors for low-cost circuit applications. Org Electron 12(2):249–256 Kim D, Lee S, Jeong S, Moon J (2009) All-ink-jet printed flexible organic thin-film transistors on plastic substrates. Electrochem Solid State Lett 12:H195-H197 Saengchairat N, Tran T, Chua C (2017) A review: additive manufacturing for active electronic components. Virtual Phys Prototyp 12:31–46 Tan H, Tran T, Chua C (2016) A review of printed passive electronic components through fully additive manufacturing methods. Virtual Phys Prototyp 11:271–288 Ready S, Arias A, Sambandan S (2009) Ink jet printing devices and circuits. In: Materials research society fall meeting, Boston, MA Ready S, Wong W, Arias A, Apte R, CHabynic M, Street R, Salleo A (2006) Toolset for printed electronics. In: International conference on digital fabrication technologies, Denver, CO Ng T, Schwartz E, Lavery L, Whiting G, Krusor RB,B, Veres J, Broms P, Herlogsson L, Alam N, Hagel O, Nilsson J, Karlsson C (2012) Scalable printed electronics: a printed decoder addressing ferroelectric nonvolatile memory. Sci Rep 2:585 Ready S, Endicott F, Whiting G, Ng T, Chow E, Lu J (2013) 3D printed electronics. In: NIP 29 and Digital Fabrication pp 9–12 MacDonald E, Wicker R (2016) Multiprocess 3D printing for increasing component functionality. Science 353:aaf2093 Jung S, Sou A, Gili E, Sirringhaus H (2013) Inkjet-printed resistors with a wide resistance range for printed read-only memory applications. Org Electron 14:699–702 3D-printing basic electronic components (2015) http://www.kurzweilai.net/3d-printing-basic-electronic-components. Accessed 6 July 2017 Wu S-Y, Yang C, Hsu W, Lin L (2015) 3D-printed microelectronics for integrated circuitry and passive wireless sensors. Microsyst Nanoeng 1:15013 Kong Y, Tamargo I, Kim H, Johnson B, Gupta M, Koh T-W, Chin H-A, Steingart D, Rand B, McAlpine M (2014) 3D printed quantum dot light-emitting diodes. Nano Lett 14:7017–7020 Goh G, Ma J, Chua K, Shweta A, Yeong W, Zhang Y (2016) Inkjet-printed patch antenna emitter for wireless communication application. Virtual Phys Prototyp 11:289–294 Adams J, Bernhard J (2009) Tuning method for a new electrically small antenna with low Q. IEEE Antennas Wireless Propag Lett 8:303–306 Adams J, Duoss EB, Malkowski T, Motala M, Ahn B, Nuzzo R, Bernhard J, Lewis J (2011) Conformal printing of electrically snall antennas on three-dimensional surfaces. Adv Mater 23:1335–1340 Baca A, Yu K, Xiao J, Wang S, Yoon J, Ryu J, Stevenson D, Nuzzo R, Rockett A, Huang Y, Rogers J (2010) Compact monocrystalline silicon solar modules with high voltage outputs and mechanically flexible designs. Energy Environ Sci 3:208–211 Rogers J, Bao Z, Baldwin K, Dodabalapur A, Crone B, Raju V, Kuck V, Katz H, Amundson K, Ewing J, Drzaic P (2001) Paper-like electronic displays: large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks. Proc Natl Acad Sci/ USA 98(9):4835–4840 Fichet G, Corcoran N, Ho P, Arias A, MacKenzie J, Huck W, Friend R (2004) Self-organized photonic structures in polymer light-emitting diodes. Adv Mater 16:1908 Someya T, Kato Y, Sekitani S, Iba Y, Noguchi Y, Murase H, Kawaguchi, Sakurai T (2005) Conformable, flexible, large-area networks of pressure and thermal sensors with organic transistor active matrixes. Proc Natl Acad Sci USA 102(35):12321–12325 Cao Q, Hur S-H, Zhu Z-T, Sun Y, Wang C, Meitl M, Shim M, Rogers J (2006) Highly bendable, transparent thin-film transistors that use carbon-nanotube-based conductors and semiconductors with elastomeric dielectrics. Adv Mater 18:304–309 Gaikwad A, Whiting G, Steingart D, Arias A (2011) Highly flexible printed alkaline batteries based on mesh embedded electrodes. Adv Mater 23:3251 Liu H, Huang W, Gao J, Dai K, Zheng G, Liu C (2016) Piezoresistive behavior of porous carbon nanotube-thermoplastic polyurethane conductive nanocomposites with ultrahigh compressibility. Appl Phys Lett 108(1):11904 Yao H, Ge J, Wang C, Wang X, Hu W, Zheng Z, Ni Y, Yu S (2013) A flexible and highly pressure-sensitive graphene–polyurethane sponge based on fractured microstructure design. Adv Mater 25(46):6692–6698 Chen Q, Cao P, Advincula R (2018) Mechanically robust, ultraelastic hierarchical foam with tunable properties via 3D printing. Adv Func Mater 28:1800631 Fan YJ, Meng XS, Li HY, Kuang SY, Zhang L, Wu Y, Wang ZL, Zhu G (2017) Stretchable porous carbon nanotube-elastomer hybrid nanocomposite for harvesting mechanical energy. Adv Mater 29(2):1603115 Liu C, Choi J (2009) An embedded PDMS nanocomposite strain sensor toward biomedical applications. In: Engineering in Medicine and Biology Society, annual international conference of the IEEE, pp 6391–6394 Amjadi M, Pichitpajongkit A, Lee S, Ryu S, Park I (2014) “Highly stretchable and sensitive strain sensor based on silver nanowire-elastomer nanocomposite. ACS Nano 8(5):5154–5163 Chen Q, Mangadlao J, Wallat J, de Leon A, Pokorski J, Advincula R (2017) 3D printing biocompatible polyurethane/poly (lactic acid)/graphene oxide nanocomposites: anisotropic properties. ACS Appl Mater Interfaces 9(4):4015–4023 Bates S, Farrow I, Trask R, RG S (2016) 3D printed elastic honeycombs with graded density for tailorable energy absorption. SPIE smart structures and materials + nondestructive evaluation and health monitoring. International Society for Optics and Photonics, Bellingham, p 979907 Christ J, Aliheidari N, Ameli A, Potschke P (2017) 3D printed highly elastic strain sensors of multiwalled carbon nanotube/thermoplastic polyurethane nanocomposites. Mater Design 131:394–401 Muth J, Vogt D, Trugby R, Menguc Y, Kolesky D, Wood R, Lewis J (2014) Embedded 3D printing of strain sensors within highly stretchable elastomers. Adv Mater 26(36):6307–6312 Choi J-H, Wang H, Oh J, Paik T, Jo P, SUng J, Ye X, Zhao T, Murray DBT,C, Kagan C (2016) Exploiting the colloidal nanocrystal library to construct electronic devices. Science 352(6282):205–208 Wehner M, Truby R, Fitzgerald D, Mosadegh B, Whitesides G, Lewis J, Wood R (2016) An integrated design and fabrication strategy for entirely soft, autonomous robots. Nature 536:451–455 Malone E, Bery M, Lipson H (2008) Freeform fabrication and characterization of Zn-air batteries. Rapid Prototyp J 14(3):128–140 Sun K, Wei T-S, Ahn B, Seo J, DIllon S, Lewis J (2013) 3D printing of interdigitated Li-Ion microbattery architecture. Adv Mater 25:4539–4543 MarketsandMarkets (2016) Printed E market by material (Ink, Substrate), technology (inkjet, screen, gravure, flexographic), device (sensors, displays, batteries, rfid, lighting, photovoltaic) and geography—Global forecast to 2022. http://www.marketsandmarkets.com/Market-Reports/printed-electronics-market-197.html. Accessed 8 Jul 2017 Sridhar A (2010) An inkjet printing-based process chain for conductive structures on printed circuit board materials. Thesis PhD, University of Twente, the Netherlands, Parashkhov R, Becker E, Riedl T, Johannes H-H, Kowalsky W (2005) All-organic thin-film transistors made of poly(3-butylthiophene) semiconducting and various polymeric insulating layers. In: W. Proc. IEEE, vol. 93, no. 7 Vornbrock ADLF, Sung D, Kang H, Kitsomboonloha R, Subramanian V (2010) Fully gravure and ink-jet printed high speed pBTTT organic thin film transistors. Org Electron 11:2037. https://doi.org/10.1016/j.orgel.2010.09.003 Pekkanen J (2007) Sintering of inkjet printed Ag nanoparticles. Master of Science thesis, Tampere, Finland Lam Research (2017) Products overview: enabling chipmakers to create the future. http://www.lamresearch.com/products/products-overview. Accessed 13 Jun 2017 Gaynor A, Meisel N, Williams C, Guest J (2014) Multi-material topology optimization of compliant mechanisms created via PlyJet three-dimensional printing. J Manuf Sci Eng 136(6):061015 Gibson I, Rosen D, Stucker B (2010) Additive manufacturing technologies. Springer, Boston Perelaer J, Schubert U, Jena F (2010) Inkjet printing and alternative sintering of narrow conductive tracks on flexible substrates for plastic electronic applications. Radio frequency identification fundamentals and applications, design methods and solutions. InTech, Rijeka, Croatia, pp 265–286 Lee J-Y, An J, Chua C (2017) Fundamentals and applications of 3D printing for novel materials. Appl Mater Today 7:120–133