30-nm two-step recess gate InP-Based InAlAs/InGaAs HEMTs

IEEE Transactions on Electron Devices - Tập 49 Số 10 - Trang 1694-1700 - 2002
T. Suemitsu1,2, H. Yokoyama1, T. Ishii1, T. Enoki1, G. Meneghesso3, E. Zanoni3
1NTT Photonics Laboratories, Kanagawa, Japan
2Massachusetts Institute of Technology, Cambridge, MA, USA
3Dipartimento di Elettronica e Informatica, Universitá di Padova and Istituto Nazionale di Fisica della Materia Sezione di Padova, Padova, Italy

Tóm tắt

Two-step recess gate technology has been developed for sub-100-nm gate InP-based InAlAs/InGaAs high-electron mobility transistors (HEMTs). This gate structure is found to be advantageous for the preciseness of the metallurgical gate length as well as a comparable stability to the conventional gate structure with an InP etch stop layer. The two-step recess gate is optimized focusing on the lateral width of the gate recess. Due to the stability of the gate recess with an InP surface, a laterally wide gate recess gives the maximum cutoff frequency, lower gate leakage current, smaller output conductance and higher maximum frequency of oscillation. Finally, the uniformity of the device characteristics evaluated for sub-100-nm HEMTs with the optimized recess width. The result reveals the significant role of the short channel effects on the device uniformity.

Từ khóa

#Indium compounds #Aluminum compounds #Gallium compounds #MODFETs #Millimeter wave FETs #Leakage currents

Tài liệu tham khảo

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