Characterization of vapour phase soldering process zone with pressure measurements

Emerald - Tập 25 Số 2 - Trang 99-106 - 2013
AttilaGéczy1, BalázsIllés1, ZsoltPéter1, ZsoltIllyefalvi‐Vitéz1
1Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary

Tóm tắt

PurposeThe purpose of this paper is to present a novel approach on the process zone characterization for direct feedback regarding the state of vapour, in order to assure a better monitoring, control and understanding of the process.Design/methodology/approachDifferent pressure sensors were applied in an experimental vapour phase soldering (VPS) station, where the hardware setup was dedicated to the current experiments. Static and dynamic pressure values were analyzed and correlated with additional thermal measurements.FindingsThe results reveal the dynamics of the vapour blanket generation. The correlated measurements show different stages of the process initialization, highlighting better accuracy than sole temperature measurements of saturated vapour identification. It is possible to trace the height of the available saturated vapour blanket with static pressure measurements.Practical implicationsThe VPS process may benefit from the more precise saturation detection, giving better control on the heat transfer, enabling more efficient production with the reduction of idle time, and resulting in better soldering quality.Social implicationsReducing the idle time of the VPS stations may result in better efficiency and smaller power consumption, reducing the environmental impact of the method.Originality/valueThe presented methods provide a completely novel approach from the aspect of process zone state variables and parameters characterization, focusing on pressure measurements.

Từ khóa


Tài liệu tham khảo

Avataneo, M., Navarrini, W., De Patto, U. and Marchionni, G. (2009), “Novel perfluoropolyethers containing 2,2,4‐trifluoro‐5‐trifluoromethoxy‐1,3‐dioxole blocks: synthesis and characterization”, Journal of Fluorine Chemistry, Vol. 130, pp. 933‐7.

Bassi, M. (2011), “Estimation of the vapor pressure of PFPEs by TGA”, Thermochimica Acta, Vol. 521, pp. 197‐201.

Benedict, R.P. (1977), “Pressure standards”, Fundamentals of Temperature, Pressure, and Flow Measurements, 2nd ed., Wiley, New York, NY, p. 310.

Cheng, W., Liu, N. and Wu, W. (2012), “Studies on thermal properties and thermal control effectiveness of a new shape‐stabilized phase change material with high thermal conductivity”, Applied Thermal Engineering, Vol. 36, pp. 345‐52.

Duck, A. and Zabel, C. (2010), “Vapour phase reflow – profiling for lead free alloys”, SMTA Proceedings of International Conference on Soldering and Reliability, Toronto, Canada, Paper No. 2.

Gatza, W. and Evans, T. (2012), “Thermal cycle reliability study of vapor phase BGA joints”, Proceedings of IPC APEX 2012, San Diego, CA, USA, Paper No. S04‐2.

Géczy, A., Illyefalvi‐Vitéz, Z. and Szőke, P. (2010), “Investigations on vapor phase soldering process in an experimental soldering station”, Micro and Nanosystems, Vol. 2, pp. 170‐7.

Huang, Y.E., Hagen, D., Dody, G. and Burnette, T. (1998), “Effect of solder reflow temperature profile on plastic package delamination”, The Proceedings of IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, USA, pp. 105‐11.

Illés, B. and Géczy, A. (2012), “Multi‐physics modelling of a vapour phase soldering (VPS) system”, Applied Thermal Engineering, No. 48, pp. 54‐62.

Illyefalvi‐Vitéz, Z., Géczy, A., Bátorfi, R. and Szőke, P. (2010), “Analysis of vapor phase soldering in comparison with conventional soldering technologies”, The Proceedings of IEEE ESTC 3rd Electronic System‐Integration Technology Conference, Berlin, Germany, pp. 1‐5.

Krammer, O. and Garami, T. (2010), “Investigating the mechanical strength of vapor phase soldered chip components joints”, The Proceedings of IEEE Int. Symposium for Design and Technology in Electronic Packaging at Pitesti, Romania, pp. 103‐6.

Krammer, O. and Garami, T. (2011), “Comparing the intermetallic layer formation of infrared and vapour phase soldering”, The Proceedings of IEEE ISSE 34th International Spring Seminar on Electronics Technology, Tatranska Lomnica, Slovakia, pp. 196‐201.

Lam, D.M. (2011), “Vapour phase soldering device”, PhD thesis, Czech Technical University in Prague, Faculty of Mechanical Engineering, available at: www.scribd.com/doc/59038543/Do‐Mai‐Lam‐Phd‐Thesis‐Vapor‐Phase‐Soldering (accessed 4 June 2012)..

Lea, C. (1989), “Heat transfer fluids for vapour phase soldering – an appraisal”, Soldering and Surface Mount Technologies, Vol. 1 No. 1, pp. 23‐32.

Lee, K.W. and Earmme, Y.Y. (1998), “Effect of geometric parameters on popcorn cracking in plastic packages during VPS process”, Finite Elements in Analysis and Design, Vol. 30, pp. 81‐96.

Lee, N.‐C. (2002), Assembly Processes: Reflow, Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies, BH Newnes, Oxford, pp. 4/77‐80.

Leicht, H. and Thumm, A. (2008), “Today's vapor phase soldering – an optimized reflow technology for lead free soldering”, paper presented at the Surface Mount Technology Association Int. Conference at Orlando, FL, USA, available at: www.ibl‐loettechnik.de/downloads/Aktuelles/Todays%20Vapor%20Phase%20Soldering%20SMTAI%20Orlando%20‐%20080820.pdf (accessed 4 June 2012)..

Leider, W. (2002), Dampfphasenlöten – Grundlagen und praktische Anwendung, Eugen G. Leuze Verlag, Bad Saulgau, pp. 31‐9.

Munroe, C. (2008a), “Beating the RoHS heat: for RoHS PCBs, vapor phase offers flexibility and lower temperatures than convection”, Circuits Assembly, 29 February, available at: http://circuitsassembly.com/cms/magazine/95/6205 (accessed 4 June 2012)..

Munroe, C. (2008b), “Vapour phase vs. convection reflow in RoHS‐compliant assembly”, Proceedings of SMTA International Wafer‐Level Packaging Conference, San Jose, CA, USA, Paper No. 4, pp. 125‐8.

Pfahl, R.C. and Ammann, H.H. (1975), “Method for soldering, fusing or bracing”, US Patent, 3,866,307.

Pietriková, A. and Durisin, J. (2009), “VPS and reliability of solder joint”, The Proceedings of IEEE SIITME 15th International Symposium for Design and Technology of Electronics Packages, Gyula, Hungary, pp. 395‐8.

Plotog, I., Cueu, T., Mihaileseu, B., Varzaru, G., Svasta, P. and Busu, I. (2010), “PCBs with different core materials assembling in vapor phase soldering technology”, The Proceedings of IEEE ISETC 9th International Symposium on Electronics and Telecommunications, Timisoara, Romania, pp. 421‐4.

Sprovieri, J. (2002), “Getting the vapors”, Electronics Assembly, 1 February, available at: www.assemblymag.com/articles/82981‐electronics‐assembly‐getting‐the‐vapors (accessed 4 June 2012)..

Strauss, R. (1998), SMT Soldering Handbook, 2nd ed., BH Newnes, Oxford, pp. 179‐88.

Suihkonen, D. (2007), “Vapor phase for lead‐free reflow”, Global SMT & Packaging, Vol. 7.9, pp. 30‐2.

Thumm, A. (2010), “Going lead free with vapor phase soldering – lead free is still a challenge for major industries”, SMTA Proceedings of International Conference on Soldering and Reliability, Toronto, Canada, Paper No. 3.

Wenger, G.M. (1987), “Evaluation and characterisation of condensation soldering fluids without sophisticated analytical equipment”, Proceedings of Nepcon West in Anaheim, CA, USA, pp. 135‐50.

Zabel, C. (2011), Condensation Reflow‐Soldering – The Soldering Process with Solutions for Future Technological Demands, available at: www.amtest.bg/press/Asscon/Vapour%20Phase%20Process.pdf (accessed 4 June 2012)..